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Type: Conference paper
Title: Folded Y-junction in substrate-integrated waveguide technology
Author: Zhao, C.
Fumeaux, C.
Lim, C.
Citation: Proceedings of the 2016 IEEE 2nd Australian Microwave Symposium, 2016, pp.19-20
Publisher: IEEE
Issue Date: 2016
ISBN: 9781509004294
Conference Name: 2016 IEEE 2nd Australian Microwave Symposium (AMS 2016) (11 Feb 2016 - 12 Feb 2016 : Adelaide, SA, Australia)
Statement of
Cheng Zhao, Christophe Fumeaux, and Cheng-Chew Lim
Abstract: This paper presents a novel Y-junction in folded substrate-integrated waveguide technology. The structure is analyzed with finite-element method using Ansys HFSS, and the simulation results show that the reflection coefficients of the 120° branch ports for the folded substrate-integrated waveguide Yjunction can satisfy the constraints for optimum performance of diplexers. In comparison with an unfolded substrate-integrated waveguide Y-junction, the characteristics of the presented structure can meet the constraints in a wider frequency band, which means that the flexibility for the selection of the up and down channel bands is increased.
Keywords: Y-junction, diplexer, folded substrate-integrated waveguide (FSIW)
Rights: © 2016 IEEE
DOI: 10.1109/AUSMS.2016.7593473
Appears in Collections:Aurora harvest 3
Electrical and Electronic Engineering publications

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