Please use this identifier to cite or link to this item: http://hdl.handle.net/2440/116562
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Type: Journal article
Title: Development of Pb-free nanocomposite solder alloys
Author: Basak, A.
Pramanik, A.
Riazi, H.
Silakhori, M.
Netting, A.
Citation: Journal of Composites Science, 2018; 2(2):1-9
Publisher: MDPI
Issue Date: 2018
ISSN: 2504-477X
2504-477X
Statement of
Responsibility: 
Animesh K. Basak, Alokesh Pramanik, Hamidreza Riazi, Mahyar Silakhori and Angus K.O. Netting
Abstract: As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC) based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs) during aging/reflow. Accordingly, this study examines the improvement of properties of SAC alloys by incorporating nanoparticles in it. Two different types of nanoparticles were added in monolithic SAC alloy: (1) Al₂O₃ or (2) Fe and their effect on microstructure and thermal properties were investigated. Addition of Fe nanoparticles leads to the formation of FeSn₂ IMCs alongside Ag₃Sn and Cu₆Sn₅ from monolithic SAC alloy. Addition of Al₂O₃ nano-particles do not contribute to phase formation, however, remains dispersed along primary β-Sn grain boundaries and act as a grain refiner. As the addition of either Fe or Al₂O₃ nano-particles do not make any significant effect on thermal behavior, these reinforced nanocomposites are foreseen to provide better mechanical characteristics with respect to conventional monolithic SAC solder alloys
Keywords: Pb free; solder alloy; nanocomposite; microstructure
Rights: © 2018 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
RMID: 0030090467
DOI: 10.3390/jcs2020028
Appears in Collections:Mechanical Engineering publications

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