Please use this identifier to cite or link to this item: http://hdl.handle.net/2440/116562
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dc.contributor.authorBasak, A.en
dc.contributor.authorPramanik, A.en
dc.contributor.authorRiazi, H.en
dc.contributor.authorSilakhori, M.en
dc.contributor.authorNetting, A.en
dc.date.issued2018en
dc.identifier.citationJournal of Composites Science, 2018; 2(2):1-9en
dc.identifier.issn2504-477Xen
dc.identifier.issn2504-477Xen
dc.identifier.urihttp://hdl.handle.net/2440/116562-
dc.description.abstractAs an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC) based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs) during aging/reflow. Accordingly, this study examines the improvement of properties of SAC alloys by incorporating nanoparticles in it. Two different types of nanoparticles were added in monolithic SAC alloy: (1) Al₂O₃ or (2) Fe and their effect on microstructure and thermal properties were investigated. Addition of Fe nanoparticles leads to the formation of FeSn₂ IMCs alongside Ag₃Sn and Cu₆Sn₅ from monolithic SAC alloy. Addition of Al₂O₃ nano-particles do not contribute to phase formation, however, remains dispersed along primary β-Sn grain boundaries and act as a grain refiner. As the addition of either Fe or Al₂O₃ nano-particles do not make any significant effect on thermal behavior, these reinforced nanocomposites are foreseen to provide better mechanical characteristics with respect to conventional monolithic SAC solder alloysen
dc.description.statementofresponsibilityAnimesh K. Basak, Alokesh Pramanik, Hamidreza Riazi, Mahyar Silakhori and Angus K.O. Nettingen
dc.language.isoenen
dc.publisherMDPIen
dc.rights© 2018 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).en
dc.subjectPb free; solder alloy; nanocomposite; microstructureen
dc.titleDevelopment of Pb-free nanocomposite solder alloysen
dc.typeJournal articleen
dc.identifier.rmid0030090467en
dc.identifier.doi10.3390/jcs2020028en
dc.identifier.pubid424624-
pubs.library.collectionMechanical Engineering publicationsen
pubs.library.teamDS14en
pubs.verification-statusVerifieden
pubs.publication-statusPublisheden
dc.identifier.orcidBasak, A. [0000-0003-2301-4758]en
dc.identifier.orcidSilakhori, M. [0000-0001-6713-1425]en
Appears in Collections:Mechanical Engineering publications

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