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Please use this identifier to cite or link to this item: https://hdl.handle.net/2440/55542
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dc.contributor.authorSun, Y. L.en
dc.contributor.authorHan, Xuen
dc.contributor.authorWang, Tianfangen
dc.contributor.authorLin, Zhenkunen
dc.contributor.authorHan, Donglinen
dc.contributor.authorLi, Shufenen
dc.date.issued2007en
dc.identifier.citation43rd AIAA/ASME/SAE/ASEE Joint Propulsion Conference & Exhibit, 8-11 July 2007, Cincinnati, OHen
dc.identifier.urihttp://hdl.handle.net/2440/55542-
dc.description.statementofresponsibilityY. L. Sun, X. Han, T. F. Wang, Z. K. Lin, D. L. Han and S. F. Lien
dc.language.isoenen
dc.publisherAmerican Institute of Aeronautics and Astronauticsen
dc.relation.ispartofseriesAIAA papers; 2007-5700en
dc.titleThe Effect of Curing Agent N-100 on the Thermal Decomposition Mechanism of Binder PEGen
dc.typeConference paperen
dc.contributor.schoolSchool of Chemistry and Physicsen
dc.contributor.conferenceAIAA/ASME/SAE/ASEE Joint Propulsion Conference & Exhibit (43rd : 2005 : Tucson, Arizona)en
Appears in Collections:Chemistry and Physics publications

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