Please use this identifier to cite or link to this item: https://hdl.handle.net/2440/55542
Type: Conference paper
Title: The Effect of Curing Agent N-100 on the Thermal Decomposition Mechanism of Binder PEG
Author: Sun, Y. L.
Han, Xu
Wang, Tianfang
Lin, Zhenkun
Han, Donglin
Li, Shufen
Citation: 43rd AIAA/ASME/SAE/ASEE Joint Propulsion Conference & Exhibit, 8-11 July 2007, Cincinnati, OH
Publisher: American Institute of Aeronautics and Astronautics
Issue Date: 2007
Series/Report no.: AIAA papers; 2007-5700
Conference Name: AIAA/ASME/SAE/ASEE Joint Propulsion Conference & Exhibit (43rd : 2005 : Tucson, Arizona)
School/Discipline: School of Chemistry and Physics
Statement of
Responsibility: 
Y. L. Sun, X. Han, T. F. Wang, Z. K. Lin, D. L. Han and S. F. Li
Appears in Collections:Chemistry and Physics publications

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