Please use this identifier to cite or link to this item:
https://hdl.handle.net/2440/55542
Type: | Conference paper |
Title: | The Effect of Curing Agent N-100 on the Thermal Decomposition Mechanism of Binder PEG |
Author: | Sun, Y. L. Han, Xu Wang, Tianfang Lin, Zhenkun Han, Donglin Li, Shufen |
Citation: | 43rd AIAA/ASME/SAE/ASEE Joint Propulsion Conference & Exhibit, 8-11 July 2007, Cincinnati, OH |
Publisher: | American Institute of Aeronautics and Astronautics |
Issue Date: | 2007 |
Series/Report no.: | AIAA papers; 2007-5700 |
Conference Name: | AIAA/ASME/SAE/ASEE Joint Propulsion Conference & Exhibit (43rd : 2005 : Tucson, Arizona) |
School/Discipline: | School of Chemistry and Physics |
Statement of Responsibility: | Y. L. Sun, X. Han, T. F. Wang, Z. K. Lin, D. L. Han and S. F. Li |
Appears in Collections: | Chemistry and Physics publications |
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