Please use this identifier to cite or link to this item: http://hdl.handle.net/2440/56760
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Type: Journal article
Title: Finite element modelling of surface acoustic wave device based corrugated microdiaphragms
Author: Dissanayake, D.
Al-Sarawi, S.
Lu, T.F.
Abbott, D.
Citation: Smart Materials & Structures, 2009; 18(9):1-11
Publisher: IOP Publishing Ltd
Issue Date: 2009
ISSN: 0964-1726
1361-665X
Statement of
Responsibility: 
Don W. Dissanayake, Said Al-Sarawi, Tien-Fu Lu and Derek Abbott
Abstract: This paper presents modelling and analysis of microdiaphragms that are designed for implantable micropump applications. Microdiaphragms are considered to be a major component of micropumps. A securely operated, electrostatically actuated, fully passive micropump is designed using a novel method, which is based on surface acoustic wave (SAW) devices and wireless transcutaneous radio frequency (RF) communication. The device is capable of extracting the required power from the RF signal itself, like RFID (ID: identification device) tags; hence the need of a battery and active electronics is negated. Moreover, a SAW correlator is used for secure interrogation of the device. As a result, the device responds only to a unique RF signal, which has the same code as was implanted in the SAW correlator. Finite element analysis (FEA) based on code from ANSYS Inc. is carried out to model the microdiaphragm, and a Rayleigh–Ritz method based analytical model is developed to investigate the validity of the FEA results. During the FEA, a three-dimensional model of the diaphragm is developed and various kinds of corrugation profiles are considered for enhancing the device performance. A coupled-field analysis is carried out to model the electrostatics–solid interaction between the corrugated microdiaphragm and the SAW device. In modelling microdiaphragms, selection of appropriate material properties and element types, application of accurate constraints, and selection of suitable mesh parameters are carefully considered.
RMID: 0020092277
DOI: 10.1088/0964-1726/18/9/095030
Appears in Collections:Electrical and Electronic Engineering publications

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