Please use this identifier to cite or link to this item: https://hdl.handle.net/2440/76414
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dc.contributor.authorLi, J.en
dc.contributor.authorShah, C.en
dc.contributor.authorWithayachumnankul, W.en
dc.contributor.authorUng, B.en
dc.contributor.authorSriram, S.en
dc.contributor.authorBhaskaran, M.en
dc.contributor.authorChang, S.en
dc.contributor.authorAbbott, D.en
dc.date.issued2012en
dc.identifier.citationProceedings of the 37th International Conference on Infrared, Millimeter and Terahertz Waves, IRMMW-THz 2012.en
dc.identifier.isbn9781467315975en
dc.identifier.issn2162-2027en
dc.identifier.issn2162-2035en
dc.identifier.urihttp://hdl.handle.net/2440/76414-
dc.descriptionExtent: 2p.en
dc.description.abstractWe present two designs of planar terahertz metamaterials for strain sensing. A series of resonance frequency shifts are obtained with differing gap widths when the sensor is under mechanical compression. The subwavelength metamaterial structures exhibit a high-Q resonance resulting in a good sensitivity to mechanical deformation. Because of the penetrability and relatively high spatial resolution of terahertz waves, the proposed metamaterial-based sensors can be embedded in materials for structural sensing.en
dc.description.statementofresponsibilityJining Li, Charan M. Shah, Withawat Withayachumnankul, Benjamin S. Y. Ung, Sharath Sriram, Madhu Bhaskaran, Shengjiang Chang and Derek Abbotten
dc.language.isoenen
dc.publisherIEEEen
dc.relation.ispartofseriesInternational Conference on Infrared Millimeter and Terahertz Wavesen
dc.rights©2012 IEEEen
dc.titlePlanar terahertz metamaterials for strain sensingen
dc.typeConference paperen
dc.contributor.conferenceInternational Conference on Infrared, Millimeter and Terahertz Waves (37th : 2012 : Wollongong, Australia)en
dc.identifier.doi10.1109/IRMMW-THz.2012.6380222en
dc.publisher.placeUSAen
pubs.publication-statusPublisheden
dc.identifier.orcidWithayachumnankul, W. [0000-0003-1155-567X]en
dc.identifier.orcidAbbott, D. [0000-0002-0945-2674]en
Appears in Collections:Electrical and Electronic Engineering publications

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