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Type: Journal article
Title: Pulsatile flow characterization in a vessel phantom with elastic wall using ultrasonic particle image velocimetry technique: the impact of vessel stiffness on flow dynamics
Author: Qian, M.
Niu, L.
Wong, K.
Abbott, D.
Zhou, Q.
Zheng, H.
Citation: IEEE Transactions on Biomedical Engineering, 2014; 61(9):2444-2450
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Issue Date: 2014
ISSN: 1558-2531
Statement of
Ming Qian, Lili Niu, Kelvin Kian Loong Wong, Derek Abbott, Qifa Zhou and Hairong Zheng
Abstract: This study aims to experimentally investigate the impact of vessel stiffness on the flow dynamics of pulsatile vascular flow. Vessel phantoms with elastic walls were fabricated using polyvinyl alcohol cryogel to result in stiffness ranging from 60.9 to 310.3 kPa and tested with pulsatile flows using a flow circulation set-up. Two-dimensional instantaneous and time-dependent flow velocity and shear rate vector fields were measured using ultrasonic particle image velocimetry (EchoPIV). The waveforms of peak velocities measured by EchoPIV were compared with the ultrasonic pulse Doppler spectrum, and the measuring accuracy was validated. The cyclic vessel wall motion and flow pressure were obtained as well. The results showed that vessel stiffening influenced the waveforms resulting from vessel wall distension and flow pressure, and the fields of flow velocity and shear rate. The stiffer vessel had smaller inner diameter variation, larger pulse pressure and median pressure. The velocity and shear rate maximized at peak systole for all vessels. The results showed a decrease in wall shear stress for a stiffer vessel, which can initiate the atherosclerotic process. Our study elucidates the impact of vessel stiffness on several flow dynamic parameters, and also demonstrates the EchoPIV technique to be a useful and powerful tool in cardiovascular research.
Keywords: Flow velocity; polyvinyl alcohol (PVA) cryogel; shear rate; ultrasonic particle image velocimetry; vessel stiffness
Rights: © 2014 IEEE
RMID: 0030007723
DOI: 10.1109/TBME.2014.2320443
Appears in Collections:Electrical and Electronic Engineering publications

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