Development of measurement system package for 3D large objects using integrated vision system
Date
2002
Authors
Lee, Y.
Lin, G.C.
Lee, S.H.
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Conference paper
Citation
International Symposium on Precision Mechanical Measurements (Preliminary Program of ISIST), 2002, pp.4/513-
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(11 Aug 2002 : Hefei, China)
Abstract
In some industrial robotic applications, measurement systems play an important role to ensure designed tasks are to be done accurately. In general, vision sensors can be used in the applications which require medium or low level of accuracy. However, for the applications requiring fairly precise measurement, vision sensors may not be suitable due to the cost and the time taking to process the image. This paper proposes a way to tackle this problem, namely to find a method to reduce the cost of the vision systems with less processing time while offering highly accurate measurements. In particular, this paper focused on the development of a measurement system for 3D large objects using a Complementary Metal-Oxide Semiconductor (CMOS) image sensor and an ultrasonic sensor integrated with a Digital Signal Processor (DSP).
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