Optimizing humic acid removal by modifying the surface chemistry of plasma polymerized allylamine coated particles
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2016
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Jarvis, K.L.
Majewski, P.
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Plasma Processes and Polymers, 2016; 13(8):802-813
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Plasma polymerized allylamine films were deposited onto quartz particles at low pressure to optimize humic acid removal by varying the plasma power, flow rate, and polymerization times. Increasing the plasma power increased the number of positively charged groups and humic acid removal. Increasing the allylamine flow rate increased the number of positively charged groups but maximum humic acid removal was observed at 6.48 sccm due to humic acid removal by positively charged and uncharged crosslinked species. Longer polymerization times increased the number of positively charged groups while similar humic acid removal resulted as the larger humic acid molecule cannot penetrate as readily into the film as the acid orange 7 used to determine the number of positively charged groups. Manipulation of the plasma parameters has shown to provide significant control over humic acid removal.
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Copyright 2016 Wiley