Structure design and system integration of 3D camera platform
Date
2016
Authors
Wang, B.
Dong, Y.
Dong, J.
Wang, L.
Editors
Advisors
Journal Title
Journal ISSN
Volume Title
Type:
Journal article
Citation
Microsystem Technologies, 2016; 22(10):2455-2462
Statement of Responsibility
Conference Name
Abstract
This article is focusing on designing a new type of high-strength, high-precision and three-dimensional (3D) parallel film shooting platform, which not only supports the cameras but also adjusts the two cameras’ distance and angle manually or automatically. Firstly, the design of the head structure of the stent comprises three layers, a bottom bracket, an intermediate bracket and a top bracket. Secondly, the main part of system integration includes a communication module and a control module. Actually, in the communication module, a chip NEC infrared remote control is used as a source of remote control signals, including the information about the stepper motor, such as rotation direction, revolution per minute and working condition. In addition, the control module is based on the microcontroller stepper motor of the STC89C51, and the stepper motor is driven by a driver chip L298N, which controls the direction and the rotation angle. Finally, the related software is programmed under C language environment in Keil uVision3. Compared with the traditional platform cameras, the new camera platform has strong stiffness, high precision and a solid structure, and it can be remotely controlled to meet the requirements of various professional shooting environments.
School/Discipline
Dissertation Note
Provenance
Description
Access Status
Rights
Copyright 2015 Springer-Verlag Berlin Heidelberg