Suspended-core Terahertz Fibers: Characterization and Validation
Date
2025
Authors
Gu, M.
An, S.
Aghdam, P.Y.
Dalgleish, J.
Ebendorff-Heidepriem, H.
Atakaramians, S.
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Advisors
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Conference paper
Citation
International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz, 2025, pp.1-2
Statement of Responsibility
Mengqin Gu, Sining An, Parisa Yadranjee Aghdam, Jacob Dalgleish, Heike Ebendorff-Heidepriem, Shaghik Atakaramians
Conference Name
International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz) (17 Aug 2025 - 22 Aug 2025 : Helsinki, Finland)
Abstract
As data rates continue to rise, conventional interconnect technologies face increasing limitations, driving the need for alternative solutions. The terahertz (THz) band is a compelling option for next-generation high-speed data links, offering broad bandwidth. Traditional copper lines suffer from bandwidth limitations. We propose a suspended-core THz fiber as an alternative for short- to medium-range interconnect between the chips. Here, we present suspended-core fibers with air cladding, fabricated through the Zeonex extrusion technique, along with experimental THz validation. Using terahertz time-domain spectroscopy (THz-TDS), we performed attenuation measurements, achieving attenuation below 0.25 dB cm−1 under 300 GHz. Future work will involve fabrication techniques to avoid taper and cross-sectional deformation, developing improved horn couplers to reduce coupling loss, and minimizing variations from different fiber pieces.
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© 2025 IEEE.