Headland, D.Withayachumnankul, W.Fujita, M.Nagatsuma, T.2021-12-142021-12-142020International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz, 2020, vol.2020, pp.[416]-[417]97817281662092162-20272162-2035https://hdl.handle.net/2440/133676A viable approach to realize substrateless, unclad terahertz silicon waveguides is presented, and a 90° bend is selected as a test case to validate the concept. This presents a promising pathway towards an efficient, versatile, and general-purpose waveguiding platform for the terahertz range.en©2020 IEEEUnclad microphotonic waveguide bendConference paper10.1109/IRMMW-THz46771.2020.93708572021-12-14572751Headland, D. [0000-0003-1527-180X]Withayachumnankul, W. [0000-0003-1155-567X]