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Type: Journal article
Title: Variational analysis of folded substrate-integrated waveguides
Author: Nghia, N.T.
Kaufmann, T.
Hall, L.
Fumeaux, C.
Citation: IEEE Microwave and Wireless Components Letters, 2015; 25(6):352-354
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Issue Date: 2015
ISSN: 1531-1309
Statement of
Nghia Nguyen-Trong, Thomas Kaufmann, Leonard Hall and Christophe Fumeaux
Abstract: An accurate numerical solution describing the propagation behavior of two types of folded substrate-integrated waveguide (FSIW) is demonstrated in this letter. The computation is based on a variational method which can be carried out efficiently by solving the stationary equation corresponding to each type of FSIW. The approach can be extended to solve various folded structures, i.e., with different gap positions, where the layers are made of substrates with different thicknesses and material properties.
Rights: © 2015 IEEE. Personal use is permitted, but republication/redistribution requires IEEE permission.
RMID: 0030032470
DOI: 10.1109/LMWC.2015.2421251
Appears in Collections:Electrical and Electronic Engineering publications

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