Please use this identifier to cite or link to this item:
|Scopus||Web of Science®||Altmetric|
|Title:||Variational analysis of folded substrate-integrated waveguides|
|Citation:||IEEE Microwave and Wireless Components Letters, 2015; 25(6):352-354|
|Publisher:||Institute of Electrical and Electronics Engineers (IEEE)|
|Nghia Nguyen-Trong, Thomas Kaufmann, Leonard Hall and Christophe Fumeaux|
|Abstract:||An accurate numerical solution describing the propagation behavior of two types of folded substrate-integrated waveguide (FSIW) is demonstrated in this letter. The computation is based on a variational method which can be carried out efficiently by solving the stationary equation corresponding to each type of FSIW. The approach can be extended to solve various folded structures, i.e., with different gap positions, where the layers are made of substrates with different thicknesses and material properties.|
|Rights:||© 2015 IEEE. Personal use is permitted, but republication/redistribution requires IEEE permission.|
|Appears in Collections:||Electrical and Electronic Engineering publications|
Files in This Item:
There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.