Unclad microphotonic waveguide bend
Date
2020
Authors
Headland, D.
Withayachumnankul, W.
Fujita, M.
Nagatsuma, T.
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Conference paper
Citation
International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz, 2020, vol.2020, pp.[416]-[417]
Statement of Responsibility
Daniel Headland, Withawat Withayachumnankul, Masayuki Fujita, and Tadao Nagatsuma
Conference Name
International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz) (8 Nov 2020 - 13 Nov 2020 : virtual online)
Abstract
A viable approach to realize substrateless, unclad terahertz silicon waveguides is presented, and a 90° bend is selected as a test case to validate the concept. This presents a promising pathway towards an efficient, versatile, and general-purpose waveguiding platform for the terahertz range.
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©2020 IEEE