Unclad microphotonic waveguide bend

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dc.contributor.authorHeadland, D.
dc.contributor.authorWithayachumnankul, W.
dc.contributor.authorFujita, M.
dc.contributor.authorNagatsuma, T.
dc.contributor.conferenceInternational Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz) (8 Nov 2020 - 13 Nov 2020 : virtual online)
dc.date.issued2020
dc.description.abstractA viable approach to realize substrateless, unclad terahertz silicon waveguides is presented, and a 90° bend is selected as a test case to validate the concept. This presents a promising pathway towards an efficient, versatile, and general-purpose waveguiding platform for the terahertz range.
dc.description.statementofresponsibilityDaniel Headland, Withawat Withayachumnankul, Masayuki Fujita, and Tadao Nagatsuma
dc.identifier.citationInternational Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz, 2020, vol.2020, pp.[416]-[417]
dc.identifier.doi10.1109/IRMMW-THz46771.2020.9370857
dc.identifier.isbn9781728166209
dc.identifier.issn2162-2027
dc.identifier.issn2162-2035
dc.identifier.orcidHeadland, D. [0000-0003-1527-180X]
dc.identifier.orcidWithayachumnankul, W. [0000-0003-1155-567X]
dc.identifier.urihttps://hdl.handle.net/2440/133676
dc.language.isoen
dc.publisherIEEE
dc.publisher.placeonline
dc.relation.granthttp://purl.org/au-research/grants/arc/DP180103561
dc.relation.ispartofseriesInternational Conference on Infrared Millimeter and Terahertz Waves
dc.rights©2020 IEEE
dc.source.urihttps://ieeexplore.ieee.org/xpl/conhome/9370343/proceeding
dc.titleUnclad microphotonic waveguide bend
dc.typeConference paper
pubs.publication-statusPublished

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