Variational analysis of folded substrate-integrated waveguides
Date
2015
Authors
Nguyen Trong, N.T.
Kaufmann, T.
Hall, L.
Fumeaux, C.
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Journal article
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IEEE Microwave and Wireless Components Letters, 2015; 25(6):352-354
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Nghia Nguyen-Trong, Thomas Kaufmann, Leonard Hall and Christophe Fumeaux
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Abstract
An accurate numerical solution describing the propagation behavior of two types of folded substrate-integrated waveguide (FSIW) is demonstrated in this letter. The computation is based on a variational method which can be carried out efficiently by solving the stationary equation corresponding to each type of FSIW. The approach can be extended to solve various folded structures, i.e., with different gap positions, where the layers are made of substrates with different thicknesses and material properties.
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© 2015 IEEE. Personal use is permitted, but republication/redistribution requires IEEE permission.