Variational analysis of folded substrate-integrated waveguides

Simple item page
dc.contributor.authorNguyen Trong, N.T.
dc.contributor.authorKaufmann, T.
dc.contributor.authorHall, L.
dc.contributor.authorFumeaux, C.
dc.date.issued2015
dc.description.abstractAn accurate numerical solution describing the propagation behavior of two types of folded substrate-integrated waveguide (FSIW) is demonstrated in this letter. The computation is based on a variational method which can be carried out efficiently by solving the stationary equation corresponding to each type of FSIW. The approach can be extended to solve various folded structures, i.e., with different gap positions, where the layers are made of substrates with different thicknesses and material properties.
dc.description.statementofresponsibilityNghia Nguyen-Trong, Thomas Kaufmann, Leonard Hall and Christophe Fumeaux
dc.identifier.citationIEEE Microwave and Wireless Components Letters, 2015; 25(6):352-354
dc.identifier.doi10.1109/LMWC.2015.2421251
dc.identifier.issn1531-1309
dc.identifier.issn1558-1764
dc.identifier.orcidNguyen Trong, N.T. [0000-0002-7776-3394]
dc.identifier.orcidFumeaux, C. [0000-0001-6831-7213]
dc.identifier.urihttp://hdl.handle.net/2440/95717
dc.language.isoen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.rights© 2015 IEEE. Personal use is permitted, but republication/redistribution requires IEEE permission.
dc.source.urihttps://doi.org/10.1109/lmwc.2015.2421251
dc.titleVariational analysis of folded substrate-integrated waveguides
dc.typeJournal article
pubs.publication-statusPublished

Files

Collections

Electrical and Electronic Engineering publications